Anterwell Technology Ltd.
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Storage Temperature: | –55 To 125 °C | Operating Temperature: | –40 To 100 °C |
---|---|---|---|
Average Input Current: | 20 MA | Supply Voltage: | –0.5 To 35 V |
Output Power Dissipation: | 250 MW | Input Power Dissipation: | 45 MW |
High Light: | electronic integrated circuit,linear integrated circuits |
HCPL-3020/HCPL-0302
0.4 Amp Output Current IGBT Gate Drive Optocoupler
Description
The HCPL-3020 and HCPL-0302 consist of a GaAsP LED optically coupled to an integrated circuit with a power output stage. These optocouplers are ideally suited for driving power IGBTs and MOSFETs used in motor control inverter applications. The high operating voltage range of the output stage provides the drive voltages required by gate-controlled devices. The voltage and current supplied by this optocoupler makes it ideally suited for directly driving small or medium power IGBTs. For IGBTs with higher ratings, the HCPL-0314/3140 (0.6 A), HCPL-3150 (0.6 A) or HCPL-3120 (2.5 A) gate drive opto-couplers can be used.
Features
• 0.4 A maximum peak output current
• 0.2 A minimum peak output current
• High speed response: 0.7 µs maximum propagation delay over temperature range
• Ultra high CMR: minimum 10 kV/µs at VCM = 1000 V
• Bootstrappable supply current: maximum 3 mA
• Wide operating temperature range: –40°C to 100°C
• Wide VCC operating range: 10 V to 30 V over temperature range
• Available in DIP 8 and SO-8 packages
• Safety approvals: UL approval, 3750 VRMS for 1 minute
• CSA approval
• IEC/EN/DIN EN 60747-5-2 approval
VIORM = 630 VPEAK (HCPL-3020),
VIORM = 566 VPEAK (HCPL-0302)
Applications
• Isolated IGBT/power MOSFET gate drive
• AC and brushless DC motor drives
• Industrial inverters
• Air conditioner
• Washing machine
• Induction heater for cooker
• Switching power supplies (SPS)
Functional Diagram
Absolute Maximum Ratings
Parameter | Symbol | Min. | Max. | Units | Note |
---|---|---|---|---|---|
Storage Temperature | TS | -55 | 125 | °C | |
Operating Temperature | TA | -40 | 100 | °C | |
Average Input Current | IF(AVG) | 20 | mA | 1 | |
Peak Transient Input Current (<1 µs pulse width, 300 pps) |
IF(TRAN) | 1.0 | A | ||
Reverse Input Voltage | VR | 5 | V | ||
“High” Peak Output Current | IOH(PEAK) | 0.4 | A | 2 | |
“Low” Peak Output Current | IOL(PEAK) | 0.4 | A | 2 | |
Supply Voltage | VCC – VEE | –0.5 | 35 | V | |
Output Voltage | VO(PEAK) | –0.5 | VCC | V | |
Output Power Dissipation | PO | 250 | mW | 3 | |
Input Power Dissipation | PI | 45 | mW | 4 | |
Lead Solder Temperature | 260°C for 10 sec., 1.6 mm below seating plane | ||||
Solder Reflow Temperature Profile | See Package Outline Drawings section |
Notes:
1. Derate linearly above 70°C free air temperature at a rate of 0.3 mA/°C.
2. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. This value is intended to allow for component tolerances for designs with IO peak minimum = 0.2 A. See Application section for additional details on limiting IOL peak.
3. Derate linearly above 85°C, free air temperature at the rate of 4.0 mW/°C.
4. Input power dissipation does not require derating.
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