MC34163P Electronic IC Chips Step−Up/Down/Inverting Switching Regulators

MC34163, MC33163

3.4 A, Step−Up/Down/ Inverting Switching Regulators

The MC34163 series are monolithic power switching regulators that contain the primary functions required for dc−to−dc converters. This series is specifically designed to be incorporated in step−up, step−down, and voltage−inverting applications with a minimum number of external components.

These devices consist of two high gain voltage feedback comparators, temperature compensated reference, controlled duty cycle oscillator, driver with bootstrap capability for increased efficiency, and a high current output switch. Protective features consist of cycle−by−cycle current limiting, and internal thermal shutdown. Also included is a low voltage indicator output designed to interface with microprocessor based systems.

These devices are contained in a 16 pin dual−in−line heat tab plastic package for improved thermal conduction.

Features

• Output Switch Current in Excess of 3.0 A

• Operation from 2.5 V to 40 V Input

• Low Standby Current

• Precision 2% Reference

• Controlled Duty Cycle Oscillator

• Driver with Bootstrap Capability for Increased Efficiency

• Cycle−by−Cycle Current Limiting

• Internal Thermal Shutdown Protection

• Low Voltage Indicator Output for Direct Microprocessor Interface

• Heat Tab Power Package

• Moisture Sensitivity Level (MSL) Equals 1

• Pb−Free Packages are Available*

MAXIMUM RATINGS (Note 1)

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1. This device series contains ESD protection and exceeds the following tests: Human Body Model 1500 V per MIL−STD−883, Method 3015. Machine Model Method 150 V.

2. Maximum package power dissipation limits must be observed.

3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

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